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ESD5B5.0ST1G
Transient Voltage
Suppressor
Micro-Packaged Diode for ESD Protection
The ESD5B Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size and bi-directional
design, it is ideal for use in cellular phones, MP3 players, and portable
applications that require audio line protection.
Specification Features
? Low Capacitance 32 pF
? Low Clamping Voltage
? Small Body Outline Dimensions: nom 0.063 ″ x 0.032 ″ (1.6x0.8 mm)
? Low Body Height: nom 0.024 ″ (0.6 mm)
? Reverse Working (Stand-off) Voltage: 5.0 V
? Peak Power up to 50 W @ 8 x 20 m s Pulse
? Low Leakage
? Response Time is Typically < 1 ns
? ESD Rating of Class 3 (> 16 kV) per Human Body Model
? IEC61000-4-2 Level 4 ESD Protection
? This is a Pb-Free Device
Mechanical Characteristics
CASE: Void‐free, transfer‐molded, thermosetting plastic
http://onsemi.com
2
1
SOD-523
CASE 502
PLASTIC
MARKING DIAGRAM
XX G
1 G 2
Epoxy Meets UL 94 V-0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
B5
M
G
= Specific Device Code
Date Code
= Pb-Free Package
QUALIFIED MAX REFLOW TEMPERATURE: 260 ° C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
Rating
Symbol
Value
Unit
IEC 61000-4-2 (ESD)
ESD Voltage
Contact
Air
Per Human Body Model
± 30
± 30
16
kV
kV
ORDERING INFORMATION
Per Machine Model
400
V
Device
Package
Shipping ?
Peak Power (Figure 1) Per 8 x 20 m s Waveform
Peak Power (Figure 2) Per 10 x 1000 m s Waveform
P PK
50
10
W
ESD5B5.0ST1G
SOD-523
(Pb-Free)
3000/Tape & Reel
Total Power Dissipation on FR-5 Board (Note 1)
@ T A = 25 ° C
Junction and Storage Temperature Range
° P D °
T J , T stg
200
-55 to
mW
° C
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
+150
Lead Solder Temperature - Maximum
T L
260
° C
(10 Second Duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR-5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
? Semiconductor Components Industries, LLC, 2008
April, 2008 - Rev. 3
1
Publication Order Number:
ESD5B5.0ST1/D
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